Unser Partner

Self-sensing cantilevers

from SCL-Sensor.Tech

SCL-Sensor.Tech develops and manufactures silicon piezo-resistive self-sensing cantilevers. This type of all-electrical cantilever allows completely new applications in the fields of AFM, nanoprobing, force measurement and other sensing applications.

Self-sensing cantilevers are equipped with a full piezo-resistive Wheatstone bridge that directly measures the cantilever signal electrically, removing the space-consuming requirement for an optical readout. Two variable resistors are on the cantilever and two on the chip. The cantilever chip is bonded onto a small PCB with a small connector for a quick and highly reproducible cantilever exchange. The sensor signal is read out and amplified by a small pre-amplifier PCB. This enables an easy and seamless integration with various instruments (e.g., SEM, TEM and many other measurement systems). The self-sensing cantilevers are available with a variety of resonance frequencies and spring constants.

Eigenschaften

Self-sensing cantilevers with Silicon tip
Self-sensing cantilevers without tip
Self-sensing cantilevers with single crystal diamond tip

Weitere Informationen

Self-Sensing Cantilevers with Silicon Tip

This is considered the standard type of self-sensing cantilever. It exhibits a sharp tip made of silicon with a tip radius of <15 nm. Normally, the cantilever is delivered on our cantilever PCB (CL-PCB) with a small 10 pin connector on its lower side. On request you can order only the Si chip without PCB and connector for bonding on your own PCB holder.

This cantilever type can come with or without an integrated heater. PRSA (Piezo-Resistive Sensing & Active) cantilever probes are equipped with an additional thermal actuator (heater structure) on the cantilever. PRS (Piezo-Resistive Sensing) cantilever probes provide the sensing Wheatstone bridge (without a thermal actuator).

Self-Sensing Tipless Cantilevers

These are self-sensing cantilevers without a tip (tipless, TL). This cantilever type is especially suitable for torque magnetometry, force sensing, gas property measurements, and many more applications. The free place where normally the AFM tip is located can be used to accept your own tip, glue a sample, or other uses. Normally, the cantilever is delivered on our cantilever PCB (CL-PCB) with a small 10 pin connector on its lower side. On request you can order only the Si chip without PCB and connector for bonding on your own PCB holder.

Self-Sensing Cantilevers with Single Crystal Diamond Tip

These are self-sensing cantilevers with a hard, sharp, long-life single crystal diamond tip (SCD). The cantilever is delivered on our cantilever PCB (CL-PCB) with a small 10 pin connector on its bottom side.

Spezifikation

	Silicon Tip Cantilevers (Si-Tip)		Tipless Cantilvers (TL)		Single Crystal Diamond Tip Cantilevers (SCD)
Model **	PRSA-L300-F60-Si-CHP		PRSA-L300-F60-TL-CHP		PRSA-L300-F50-SCD-PCB
Model **	PRSA-L300-F50-Si-PCB	PRSA-L300-F80-Si-PCB	PRSA-L300-F50-TL-PCB	PRSA-L300-F80-TL-PCB
Tip radius (apex)	<15 nm				<15 nm / 12…16 µm
Tip height	4…6 µm				Long life Single Crystal Diamond (SCD) <100> along tip axis
Tip material	silicon				non-conducting temp-stability: up to 70°C
Resonant frequency **	30..65 kHz	65…95 kHz	30…65 kHz	65…95 kHz	30..65 kHz
Spring constant **	1…15 N/m	15…56 N/m	1…15 N/m	15…56 N/m	1…15 N/m
Recomm. AFM mode	contact, non-contact	non-contact			contact, non-contact
sensitivity*	1…2 µV/nm		1…2 µV/nm		1…2 µV/nm
force sensitivity*	0.5…56 nN/µV		0.5…56 nN/µV		0.5…56 nN/µV
Length, width	300 ±5 µm, 110 ±3 µm		300 ±5 µm / 110 ±3 µm		300 ±5 µm, 110 ±3 µm
Material	silicon cantilever, boron doped 1k Ohm piezo resistors, aluminium tracks		silicon cantilever, boron doped 1k Ohm piezo resistors, aluminium tracks		silicon cantilever, boron doped 1k Ohm piezo resistors, aluminium tracks
Deflection sensing	on chip piezo-resistive bridge		on chip piezo-resistive bridge		on chip piezo-resistive bridge
Actuator	external shaker or on chip heater (20-45 Ohm)		external shaker or on chip heater		external shaker or on chip heater (20-45 Ohm)
Electrical connections	bonded to small PCB with connector (counter part PCB available) or optional bonding pads on chip		bonded to small PCB with connector (counter part PCB available) or optional bonding pads on chip		bonded to small PCB with connector (counter part PCB available) or optional bonding pads on chip
Chip dimensions (h, w, l)	0.3 / 1.2 / 2.5 mm		0.3 / 1.2 / 2.5 mm		0.3 / 1.2 / 2.5 mm
	* not amplified (signal direct at the chip), 2.048 V bridge supply ** Cantilever models are divided in two parameter ranges when electrical characterization is possible with bonded cantilevers		* not amplified (signal direct at the chip), 2.048 V bridge supply ** Cantilever models are divided in two parameter ranges when electrical characterization is possible with bonded cantilevers		* not amplified (signal direct at the chip), 2.048 V bridge supply