New thin film stress measurement system FLX 2000-A
Toho Technology has extended their portfolio by another film stress measurement system. It utilizes patented “Dual Wavelength” technology to measure the deflection of a wafer including deposited thin films and the Stoney equation to determine the resulting wafer/film stress.
Toho’s new system FLX 2000-A boasts the same features as the FLX-2320-S and -R minus the temperature control and automated sample stage. The system is easy to use, extremely robust, and very fast, thanks to the optical measurement. The manual quick-touch rotational platform allows easy 3D mapping. The system is ideal for use in Academic settings or low volume fabs. As with the other systems, WinFLX Software is used for analysis.
This intuitive analysis software displays any combination of stress, time, surface deflection, or reflected light intensity measurements. It calculates the biaxial modulus of elasticity, linear expansion coefficient, and stress uniformity. It allows trend plotting for Statistical Process Control (SPC) and the automatic recalculation of stress.
| FLX 2000-A | FLX 2320-S | FLX 2320-R | FLX 3300-T | |
| Wafer sizes | 25 - 200mm | 25 - 200mm | 25 - 200mm | 200&300 mm |
| Temperature measurements to 500°C | No | Yes | No | Yes |
| Rotational stage | Yes (manual) | No | Yes (manual) | No |
| Patented Dual-Laser technology | Yes | Yes | Yes | Yes |
The table shows the differences between the two Flexus models.
