Sputter Coater with large sample chamber
Q300T Plus-Series from Quorum TechnologiesThe Q300T Plus series are fully automated, modular coating systems with large vacuum chambers for applying fine-grained films for SEM, TEM and thin-film technology. The Q300T Plus can be acquired as a sputter coater with three targets (TT), with two targets for sequential deposition (TD) or as combined system for sputter coating, as well carbon and metal evaporation (TES).
- Fully automated coating process
(incl. download of process log files in .csv format via USB) - Built-in turbo pump, vacuum down to 5 x 10-5 mbar
- Extra-large sample chamber: 300 mm Ø
- Fast turnover times / coating cycles
- Q300T T Plus: sputter coater with 3 targets
- Q300T D Plus: sputter coater with 2 targets for sequential coating
- Q300T ES Plus: combined system for sputter coating, carbon and metal evaporation
Further information
The Q300T Plus series is available in three configurations:
- Q300T T Plus – Sputter coater for precious metals and oxidising metals with 3 targets, high vacuum, for coating samples with max. 20 cm diameter.
- Q300T D Plus – Sputter coater for precious metals and oxidising metals with 2 targets for sequential coating of samples with max. 15 cm diameter, high vacuum.
- Q300T ES Plus – Carbon, metal evaporation and sputter coating for precious metals and oxidising metals (interchangeable inserts) for coating samples with max. 15 cm diameter metal evaporation and 10 cm for sputtering and carbon evaporation, high vacuum.
The different head plates can easily be exchanged within seconds. The unit recognizes the replacement and the operating menu changes accordingly. A touch screen is used to enter coating parameters, display the coating sequence and show error messages. Multiple users can store up to 1000 recipes including all parameters. By awarding access rights, selected parameters can be protected against deletion and unauthorized modification. Only the administrator has access to all settings. A USB-port allows the download of recipes and process logs.
Several optional sample stages ensure the efficient and reproducible coating of samples within a wide range of geometries.
The fully automated process does not require tedious adjustment of a needle valve to control argon gas flow. Instead, the user can control the process vacuum, gas flow is adjusted automatically. Depending on the set gas value (vacuum), the voltage is adjusted accordingly and the desired sputter current (mA) is kept at a constant. This way, samples with strongly irregular topography can also be uniformly coated at low sputtering currents.
The glass chamber can be completely removed, granting easy access to the sample stage and facilitating the cleaning process.
Operating principle: magnetron sputtering
Magnetron sputter coaters (also referred to as "Cool Sputter Coaters") are equipped with a special magnet, which is located in the sputter head (cathode) near the target.
Benefits are:
- electrons are available for ionization of further process gas ions
- excessive heating is avoided
- optimisation of the utilisable target surface
During sputter coating, a vacuum is produced in a vacuum chamber and a process gas, preferably argon, is continuously leaked into the chamber. Argon has an optimal ion size and does not chemically react with other molecules.
Within a vacuum window from approx. 1 x 10-1 mbar to 5 x 10-3 mbar, process gas atoms are ionized in an electrical field, which creates a plasma. Positively charged argon atoms are accelerated towards the magnetron head with the target (cathode) and erode target atoms, which reach all surfaces within the vacuum chamber, including the sample to be coated.
Specifications
| Q300T T / D / ES Plus | |
|---|---|
| Instrument case | 590 mm B x 535 mm D x 420 mm H (total height with coating head open: 772 mm) |
| Weight | 36.5 kg |
| Work chamber | Borosilicate glass 300 mm OD x 127 mm H |
| Safety shield | Polyethylene terephthalate (PET) – cylinder |
| Display | 115.5 mm x 86.4 mm (active area) capacitive touch colour display |
| User interface | Intuitive full graphical interface with touch screen buttons, includes log of the last 1000 processes and USB-port. |
| Sputter target | Q300T T Plus – incl. 3 chromium targets Q300T D Plus – incl. 1 chromium and 1 gold target Q300T ES Plus – incl. 1 chromium target |
| Vacuum | |
| Turbomolecular pump | Internally mounted, 70 l/s air-cooled |
| Rotary pump | 50 l/min. two-stage rotary pump with oil mist filter (order separately, see AG-DS102) |
| Vacuum measurement | Pirani gauge as standard. A full range gauge (10428) is available as an option |
| Typical ultimate vacuum | ∼5x10-5 mbar in a clean system after pre-pumping with dry nitrogen gas |
| Sputter vacuum range | Between 5x10-3 and 5x10-2 mbar |
| Specimen stage | 50 mm Ø rotation stage. Rotation speed 8-20 RPM. For alternative stages see options and accessories |
| Applications | |
| Sputtering | 0–150 mA to a pre-determined thickness (with optional FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without breaking vacuum and with built in cooling periods). Q300TT Plus – 3 magnetron heads for evenly coating large surfaces up to 20 cm Ø Q300TD Plus – 2 magnetron heads for sequentially coating with 2 different materials without breaking vacuum Q300TES Plus – 1 magnetron head for evenly coating large surfaces up to 10 cm Ø |
| Carbon evaporation (only Q300T ES Plus) | A robust, ripple free DC power supply featuring pulse evaporation or ensures reproducible carbon evaporation from rod or fibre sources. Current pulse: 1–90 A |
| Metal evaporation (only Q300T ES Plus) | For thermal evaporation of metals from filaments or boats for evenly coating surfaces up to 15 cm Ø |
| Further Information | |
| Gases | Argon sputtering process gas, 99.999% |
| Electrical supply | 90–250 V 50/60 Hz 1400 VA including rotary pump power. 110/240 V voltage selectable. |
| Conformity | CE conformity: Power factor correction. Complies with the current legislation (CE Certification) and ensures efficient use of power, which means reduced running costs |
| Options and accessories | |
| 10596 | Extended height vacuum chamber (214 mm h x 283 mm Ø), recommended to increase distance target/sample surface. |
| AL410-414 | Nine-place TEM grid holder |
| 12996 | Additional sputter insert for quick metal change (TE and TES versions only). NB: This is an entire sputtering assembly; individual targets can also be purchased. |
| 10067 | Standard stage with six stub positions for 15 mm or 6.5 mm or 1/8" pin stubs. |
| 10788 | 4” stub holder to accept up to 18 1/8 pin stubs |
| 10360 | 50 mm Ø rotary tilting stage. A rotary planetary style stage with variable tilt angle from horizontal to 30°. The platform has six positions for either 15 mm, 10 mm, 6.5 mm disc stubs or 1/8" pin stubs. Rotation speed is variable between pre-set limits. NB: Depending on specimen height, this stage may require the optional extended height cylinder. |
| 10357 | Rotate-tilt stage with six stub positions for 15 mm or 6.5 mm or 1/8" pin stubs, tilts up to 90° horizontally. |
| 10358 | Microscope slide stage for up to two 75 mm x 25 mm slides or eight stub positions for pin stubs. |
| 12043 | A stage to accept 9 20 x 20 cover slips. The top part of stage lifts off and has a mechanism to lift the cover slips for easy removal. |
| 12305 | 4 Place 25 mm stub stage with locking screws. May be fitted to 10360 “RotaCota” stage. |
| 10808 | 8 places for 25 or 30 mm polished embedded samples. Includes a polished brass tally. |
| 11856 | 14 places for 25 or 30 mm polished embedded samples. Includes a polished brass tally. |
| 10787 | Adjusts to accept 2”, 3” & 4” wafers, comes with a 4” stub holder to accept up to 18 1/8 pin stubs. |
| 10810 | Adjusts to accept 4” & 6" wafers comes with 10882, a 6” stub holder to accept up to 27 1/8 pin stubs. |
| 10882 | A 6” stub holder to accept up to 27 1/8 pin stubs. |
| 10428 | Coating shield assembly. Shields can be fitted to protect large surfaces from coating deposition, easily removable for ease of cleaning |
| 10994 (only with Q300T D Plus) | Rotating specimen stage to accept 4"/100 mm or 6"/150 mm wafers, with rotation variable between pre-set limits. |
| 10779 (only with Q300T D Plus) | 2 Film thickness monitors including oscillators, feed-through, quartz crystal holder and two C5460 quartz crystal. |
| 10454 (only Q300T ES Plus) | Film thickness monitor including oscillator, feed-through, quartz crystal holder and one C5460 quartz crystal. |
| 11520 (only with Q300T T Plus) | Film thickness monitor (FTM) attachment. Including oscillator, feed-through, quartz crystal holder and one C5460 quartz crystal. |
| 12937 (only with Q300T ES Plus) | Conductance film monitor (CFM) attachment including housing, feedthrough, glass slides and cable. A factory fitted only option for monitoring sheet resistance of evaporated films allowing termination at a known resistance. |
| 12624 (only with Q300T T Plus) | Stage to accept 6” square wafer or masks. |
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Quantum Design AG
Route du Roule 41
CH-1723 Marly
Switzerland
| Phone: | +41 21 8699-033 |
| E-Mail: | suisse@qd-europe.com |
