Optical Metasurfaces & Metalenses

from Moxtek

MOXTEK has been producing nanostructured optical components for over 20 years. They are capable of manufacturing various nanostructure devices on Ø200mm wafers in high volumes.

MOXTEK’s product range comprises the fabrication of functional nanostructures such as microlens arrays, waveguides, patterned meta-surfaces and meta-lenses, diffractive optical elements (DOEs), photonic crystals and biosensor arrays. These devices for imaging, illumination and display systems are used, for example, in the automotive industry, in medical and dental imaging, in camera systems and many other areas.

Features

High-volume manufacturing
Prototyping Options
NanoImprint Lithography (NIL)
Design Master Shuttle
Master creation, stamp making

Further information

Metasurfaces and Metalenses offer high potential as replacements for classical optical components such as lenses or filters. They are a fundamentally new method of light manipulation based on scattering by nanostructures rather than conventional refraction. Thus, they allow efficient phase, polarization and emission control.

In collaboration with customers, MOXTEK verifies designs and develops solutions for high-volume manufacturing. This includes options for prompt design iterations and print optimization. MOXTEK has established Statistical Process Control (SPC) for monitoring post-print Critical Dimension (CD) repeatability.

Prototyping samples can be created with their proprietary Design Master Shuttle. This NIL Design Master Shuttle includes space for multiple (different) design structures, which allows engineers to test several designs on a single shuttle iteration. This dramatically reduces development time and cost. These design shuttles are processed several times a year. We can add your particular design on our next Design Master Shuttle for prototyping your latest lens or nanostructure optical device.

On more than 2.400m² of clean room space, MOXTEK offers state-of-the-art manufacturing on Ø200mm wafers with an annual volume capability of several hundreds of thousands of wafers.

Manufacturing Capabilities

High-volume manufacturing
Prototyping Options
NanoImprint Lithography (NIL)
Design Master Shuttle
Master creation, stamp making
Deposition (PECVD, Sputter, ALD)
Etching (metals, oxides with low to high refractive index)
AFM and SEM
Optical metrology and inspection

Configurable Parameters

Minimum CD: 30nm
Master-Aspect Ratio: ≤ 2 (CD Height/Width)
Master Wafer Type: Silicon (preferred)
Master Wafer Size: Ø300mm, Ø200mm (preferred) Ø150mm (acceptable)
Residual Layer Thickness: 15nm < X < 25nm
Substrate: Ø200mm glass/fused silica/silicon/sapphire Thickness: 0.675mm to 1.8mm
Resist Mask: Oxide-based sol gel, UV-curable, or nano particle resist