Méta-surfaces optiques et méta-lentilles

Moxtek

MOXTEK produit des composants optiques nanostructurés depuis plus de 20 ans. La société est capable de fabriquer divers dispositifs à nanostructure sur des plaquettes de Ø200mm en grands volumes.

La gamme de produits de MOXTEK comprend des matrices de microlentilles, des guides d'ondes, des métasurfaces à motifs, des éléments optiques diffractifs (DOE), des cristaux photoniques et des réseaux de biocapteurs. Ces composants sont utilisés dans les systèmes d'imagerie, d'éclairage et d'affichage pour une variété d'applications telles que l'imagerie automobile, médicale et dentaire, les systèmes de caméras, et bien d'autres.

Caractéristiques

Fabrication en grand volume
Options de prototypage
Lithographie par nano-impression (NIL)
Création de master et de tampon d’impression

Plus d'informations

In collaboration with customers, MOXTEK verifies designs and develops solutions for high-volume manufacturing. This includes options for prompt design iterations and print optimization. MOXTEK has established Statistical Process Control (SPC) for monitoring post-print Critical Dimension (CD) repeatability.

Prototyping samples can be created with their proprietary Design Master Shuttle. This NIL Design Master Shuttle includes space for multiple (different) design structures, which allows engineers to test several designs on a single shuttle iteration. This dramatically reduces development time and cost. These design shuttles are processed several times a year. We can add your particular design on our next Design Master Shuttle for prototyping your latest lens or nanostructure optical device.

On more than 2.400m² of clean room space, MOXTEK offers state-of-the-art manufacturing on Ø200mm wafers with an annual volume capability of several hundreds of thousands of wafers.

Manufacturing Capabilities

High-volume manufacturing
Prototyping Options
NanoImprint Lithography (NIL)
Design Master Shuttle
Master creation, stamp making
Deposition (PECVD, Sputter, ALD)
Etching (metals, oxides with low to high refractive index)
AFM and SEM
Optical metrology and inspection

Configurable Parameters

Minimum CD: 30nm
Master-Aspect Ratio: ≤ 2 (CD Height/Width)
Master Wafer Type: Silicon (preferred)
Master Wafer Size: Ø300mm, Ø200mm (preferred) Ø150mm (acceptable)
Residual Layer Thickness: 15nm < X < 25nm
Substrate: Ø200mm glass/fused silica/silicon/sapphire Thickness: 0.675mm to 1.8mm
Resist Mask: Oxide-based sol gel, UV-curable, or nano particle resist