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Fast non-destructive 3D analysis for advanced packaging and semiconductors

Apex Hybrid from Sigray

The Apex Hybrid from Sigray combines laminography and tomography in a single X-ray microscope, enabling fast, precise and non-destructive analysis of modern semiconductor and packaging structures.
With a spatial resolution down to 350 nm and the patented Precision Angle Laminography (PAL) geometry, the system delivers high-resolution 3D images even for large, intact samples such as 300 mm wafers, panels or printed circuit boards.

Features

Dual-mode imaging: laminography and tomography in one system
350 nm spatial resolution with high throughput
Patented PAL geometry for artifact-free 3D imaging
Open nanofocus X-ray source with automatic calibration
Fully automated sample handling and GPU-accelerated reconstruction
Ideal for advanced packaging, TSVs, RDLs, microbumps and hybrid bonds

Further information

As electronic devices become smaller and more complex, inspection challenges in advanced packaging increase dramatically. Traditional computed tomography (CT) struggles with large, flat samples such as wafers or printed circuit boards, while conventional laminography suffers from incomplete data and reconstruction artifacts.

The Sigray Apex Hybrid solves these issues with a dual-mode design that merges laminography and tomography within a single compact system. This approach allows users to capture both macro-scale overviews and submicron details — without switching instruments or repositioning samples.

X-ray cross-sectional view of advanced packaging structures with 100 µm scale bar

Representative X-ray view of advanced packaging structures (scale: 100 µm).

Precision Angle Laminography (PAL)

Sigray’s patented Precision Angle Laminography (PAL) provides exceptional image clarity by minimizing the “missing-cone” problem of traditional laminography. With shallow projection angles between 10° and 20° and an ultra-stable air-bearing rotation, PAL delivers artifact-free visualization of critical vertical features such as through-silicon vias (TSVs), microbumps, and redistribution layers (RDLs).

Dual-mode flexibility

In laminography mode, users can rapidly inspect large or fully assembled boards, panels, or wafers. For regions requiring higher detail, the system seamlessly switches to tomography mode, achieving up to 350 nm spatial resolution. This hybrid workflow saves preparation time and enhances efficiency in both R&D and production environments.

Side-by-side: X-ray slice and 3D reconstruction of a stacked interconnect, scale 100 µm

Dual-mode workflow from overview to high-resolution 3D reconstruction (scale: 100 µm).

High-performance X-ray source and calibration

The Apex Hybrid features an open transmission X-ray source with a tungsten-on-diamond target. Internal calibration patterns automatically measure the effective focal spot for every scan, ensuring metrological accuracy and consistency over long operation periods. Compared with sealed-tube sources, the open design offers extended lifetime and significantly lower maintenance costs.

X-ray source control UI showing selectable spot sizes for calibrated imaging

Internal calibration and spot-size control ensure metrologically consistent imaging.

Automation and detector options

For laboratories with high sample throughput, the Apex Hybrid can be configured with an in-system sample robot capable of handling up to ten 100 × 100 mm samples automatically. Users can select between several detector options: HyperCapture (7 MP), HyperCapture-XL (13 MP) or UltraVision (16 MP). Sigray’s optional MegaView montage module combines multiple scans into a seamless, large-scale 3D dataset for complete inspection of printed circuit boards or complex packages.

In-system sample robot with multi-slot cassette for unattended operation

Automation-ready design with in-system sample robot for unattended operation.

Sigray software multi-view interface for 3D visualization and analysis

Sigray’s software provides multi-view visualization and analysis of 3D datasets.

Why choose Apex Hybrid

Two imaging systems in one: laminography and tomography combined for unmatched flexibility.
Exceptional clarity: PAL geometry eliminates common laminography artifacts.
Submicron precision: 350 nm spatial resolution with internally calibrated X-ray source.
Automation-ready: robotic handling and scripting via Python API streamline workflows.
Scalable and future-proof: ideal for semiconductors, advanced packaging, batteries, and materials science.

Specifications

Parameter	Specification
Spatial resolution	350 nm (voxel < 100 nm)
Imaging modes	Laminography / Computed Tomography
Maximum sample size	Laminography: 300 mm wafer / 213 × 213 mm panel CT: 150 × 150 mm
Stage travel (XYZ)	100 × 20 × 100 mm
X-ray source	Open transmission source, tungsten-on-diamond (40–160 kV / 16 W)
Detectors	6.7 MP / 13 MP / 16 MP (UltraVision option)
Software	XRM Companion · GigaRecon · Sigray 3D Viewer · Python API
Typical applications	Advanced packaging · Microbumps · TSVs · Batteries · Reverse engineering

Applications

The Apex Hybrid is designed for industries where precision, reliability, and throughput are essential. Its dual-mode architecture supports a wide range of applications, from advanced packaging to materials research.

Advanced packaging: detailed 3D inspection of TSVs, RDLs, microbumps, and hybrid bonds.
Failure analysis: rapid detection and localization of hidden defects in semiconductor assemblies.
Reverse engineering: non-destructive structural analysis of PCBs, ICs, and multi-chip modules.
Battery research: visualization of internal electrode structures and degradation over time.
Materials science: high-resolution imaging of composites, ceramics, and microstructured materials.

With its combination of imaging flexibility, automation, and precision, the Apex Hybrid provides a single platform to accelerate innovation across R&D and production environments.