Good news for all who have been waiting for Toho to update the operating system of the FLX Flexus thin film stress measurement systems. Toho has announced that the transition from Windows 7 to Windows 10 will soon be completed. The Flexus system is used to measure mechanical tension within a thin film sub- strate material compounds. Possible substrates are silicon wafers, optical mirrors, lenses, glass and other smooth surface. The thin films may consists of oxide layers, polymers and metals. Especially with display and LED applications, high tensions inside a compound can lead to critical errors in the parts made by them. When you order a new FLX system you will now receive a tool that can be operated with Windows 10.
Please contact us, if you are interested in an update!